2003.12-2007.06，英国拉夫堡大学，博士；

1999.09-2001.07，哈尔滨工业大学，硕士；

1995.09-1999.07，哈尔滨工业大学，本科。

2019.10-至今， bevictor伟德官网，教授，博导；

2018.05-2019.08，英国伦敦帝国理工学院，研究员；

2008.02-2018.04，英国伦敦帝国理工学院，副研究员；

2007.07-2008.01，英国拉夫堡大学，副研究员；

2002.03-2003.03，香港城市大学，助理研究员。

微电子机械系统概论，48学时，本科

MEMS基础及应用(全英文、研讨)，32学时，本科

工程图学，32学时，本科

新生研讨课，吴健雄学院，本科

电子封装可靠性及优化 （全英文），32学时，研究生

创新半导体工艺：

1、 传感器结构工艺；

2、 特种封装技术；

3、 封装与系统集成；

MEMS传感技术：

1、硅基传感芯片；

2、石英基传感芯片；

3、极端环境可靠性。

主持重大科研项目：

1、国家级课题， 高深宽比硅通孔TSV工艺，2024.01-2026.12，220万元，在研，主持

2、南京市紫金山高峰人才项目， 基于MEMS技术的5G用石英芯片研发与产业化，2024.01-2026.12，500万元，在研，主持（1/1）

3、江苏省住建厅，智能化窨井盖建设标准， 2021.08-2023.07，23万元，结题，主持

4、东大-中电58所联合研发中心，2021.05-2026.04，500万元，在研，主持

5、华为公司，8506006126，QMEMS项目，2022.01- 2023.07，104万元，结题，主持

6、英国工程与自然科学研究委员会（EPSRC）基金项目，Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects，2018.04-2021.10，27万英镑，结题，主持

7、英国工程与自然科学研究委员会（EPSRC）基金项目，System Integration for Plastic Electronics Manufacturing，2016.11-2018.02，10.8万英镑，结题，主持

8、英国工程与自然科学研究委员会（EPSRC）基金项目，Interconnection Technologies for Integration of Active Devices with Printed Plastic Electronics，2017.11-2019.04，15.5万英镑，结题，主持

代表性论文：

（1）近5年内发表的5篇论著（均为通讯作者）

1、Yide Dong, Chunyan Yin, Guangbin Dou* and Litao Sun*. One-step quartz-MEMS micro-fabrication strategy for grooved tuning[J]. Nanotechnology and Precision Engineering[J], 2025, Vol.8(2), doi: 10.1063/10.0036171.

2、Yide Dong, Guangbin Dou*, Zibiao Wei, Shanshan Ji, Huihui Dai, Kaiqin Tang and Litao Sun*. Size-Effect-Based Dimension Compensations in Wet Etching for Micromachined Quartz Crystal Microstructures[J]. Micromachines, 2024, Vol.15(6), p.784.

3、Haizhou Huang, Jiaxin Shen, Shu Wan, Longxiang Han, Guangbin Dou* and Litao Sun*. Wet-adhesive multifunctional hydrogel with anti-swelling and a skin-seamless interface for underwater electrophysiological monitoring and communication[J], ACS Applied Materials & Interfaces, 2023, Vol.5(9), pp. 11549-11562.

4、Haizhou Huang, Yide Dong, Shu Wan, Jiaxin Shen, Chen Li, Longxiang Han, Guangbin Dou* and Litao Sun*. A transient dual-type sensor based on MXene/cellulose nanofibers composite for intelligent sedentary and sitting postures monitoring[J], Carbon, 2022, Vol.200, pp. 327-336.

5、Nan Wu, Shu Wan, Shi Su, Haizhou Huang, Guangbin Dou* and Litao Sun*. Electrode materials for brain–machine interface: A review[J], 2021, InfoMat, Vol.3(11), pp.1174-1194.

（2）近5年内发表的其他论著（均为通讯作者）

1、Songxiang Ji, Chunyan Yin, Guangbin Dou* and Litao Sun*. Design and fabrication of an accelerometer structure using glass fiber reinforced epoxy resin for seismic P-wave early warning[J]. Measurement, 2025, Vol.242, p.115842.

2、Jingli Liu, Chunyan Yin*, Chenhui Xia, Xuefei Ming and Guangbin Dou*. Precise Morphology Tailoring of Through Glass Vias Perforated by Selective Laser-Induced Etching on Fused Silica[J]. JOM, 2025, Vol.77(4), pp.1807–1814.

3、Yide Dong, Yike Zhou, Haizhou Huang, Bosong Zhang, Xihan Li, Kaiwen Chen, Litao Sun* and Guangbin Dou*. Etching of quartz crystals in liquid phase environment: A review[J]. Nanotechnology and Precision Engineering, 2024, Vol.7(2), p.025001.

4、Jingli Liu, Chenhui Xia, Xuefei Ming, Guangbin Dou* and Chunyan Yin*. Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser-Induced Etching with Nanochannels[J]. Advanced Engineering Materials, 2024,  Vol.26(13), p.2400397.

5、 孙卓, 孙立涛, 窦广彬*. 石英单晶微机械陀螺仪研究进展[J]. 微纳电子技术, 2024, Vol.61(11), pp.17-30.

6、Yutong Zhang, Guangbin Dou*, Chunyan Yin, Xinran Zhao and Gang Wang. Experimental and Modeling Analysis on Mechanical Performance of Wafer-Level Micro-Sized SnAg Solder Bump[C]. 25th International Conference on Electronic Packaging Technology (ICEPT 2024). 2024, Tianjin, China, DOI: 10.1109/ICEPT63120.2024.10668718

7、Jiang Li, Guangbin Dou*, Chunyan Yin, Ke Zhang and Gang Wang. Optimization of Thermocompression Bonding Process for Fine-Pitch Flip-Chip Applications[C]. 25th International Conference on Electronic Packaging Technology (ICEPT 2024). 2024, Tianjin, China, DOI: 10.1109/ICEPT63120.2024.10668417

8、Yide Dong, Zibiao Wei, Chunyan Yin, Litao Sun and Guangbin Dou*. Size-effect on the undercut and dimension compensations in wet etching for micromachined quartz crystal microstructures[C]. 25th International Conference on Electronic Packaging Technology (ICEPT 2024). 2024, Tianjin, China, DOI: 10.1109/ICEPT63120.2024.10668711（最佳论文奖）

9、Meng Nie, Pengfan Chen, Lei Wen, Jinwen Fan, Qian Zhang, Kuibo Yin and Guangbin Dou*. Wearable Recognition System for Complex Motions Based on Hybrid Deep-Learning-Enhanced Strain Sensors[J]. Advanced Intelligent Systems, 2023, Vol.5(11), p.2300222.

10、Yue Zhan, Kuibo Yin, Meng Nie and Guangbin Dou*. Selective Laser-induced Etching of Borosilicate Glass in Hydrofluoric Acid[C]. 24th International Conference on Electronic Packaging Technology (ICEPT 2023), 2023, Shihezi City, China DOI:10.1109/ICEPT59018.2023.10492430

11、Qifan Wu, Chunyan Yin, Xuefei Ming, Zheng Ke, Jiachang Zhu and Guangbin Dou*. Interconnection Performance of Copper Core Solder Joints in Ball-Grid-Array Package[C]. 24th International Conference on Electronic Packaging Technology (ICEPT 2023), 2023, Shihezi City, China, DOI: 10.1109/ICEPT59018.2023.10491899 

12、Guangbin Dou*, Yike Zhou and Yide Dong. Effect of isopropyl alcohol acetic acid and sodium dodecyl sulfate on the etching rate and surface roughness of Z-cut quartz etched by BOE solution[C]. 24th International Conference on Electronic Packaging Technology (ICEPT 2023), 2023, Shihezi City, China, DOI: 10.1109/ICEPT59018.2023.10492422

13、Meng Nie*, Lei Wen, Shuning Chen, Lu Ai, Jingcheng Shen, Yu-na Zhao, Kuibo Yin and Guangbin Dou*. Strain Sensor with Enhanced Sensitivity for Wearable Electronics Using an Over-balanced Planar Elastomer[J]. Macromolecular Materials and Engineering, 2022, Vol.307(2), p.2100576.

14、Haizhou Huang, Nan Wu, Hui Liu, Yide Dong, Longxiang Han, Shu Wan, Guangbin Dou* and Litao Sun*. Directional Sweat Transport and Breathable Sandwiched Electrodes for Electrocardiogram Monitoring System[J]. Advanced Materials Interfaces, 2022, Vol.9(4), p.2101602.

（3）5年以外的代表性论著5篇（均为通讯作者）

1、Guangbin Dou*, Andrew S.Holmes. System Integration for Plastic Electronics Using Room‐Temperature Ultrasonic Welding[J]. Advanced Engineering Materials, 2020, Vol.22(5), p.1901309.

2、Bin Li, Chunqing Wang*, Guangbin Dou*, Zhenbin Wang and Weidong Fei. Crystallized Bi0.9La0.1Fe0.95Mn0.05O3/Ba0.7Sr0.3Ti0.95Co0.05O3 bilayer thin films with enhanced multiferroic properties[J]. Applied Surface Science, 2017, Vol.404, pp. 162-167.

3、Wei Liu, Chunqing Wang*, Guangbin Dou*, Yanhong Tian and Lei Yang. Laser-induced actuation of individual microsize liquid metal droplets on an open solid surface[J]. Applied Physics Express, 2016, Vol.10(1), p. 017202. 

4、Guangbin Dou* and Andrew S. Holmes, Eric M. Yeatman, Robert V. Wright, Paul B. Kirby and Chunyan Yin. Transfer of Functional Ceramic Thin Films Using a Thermal Release Process[J]. Advanced Materials, 2011, Vol.23(10), pp.1252-1256.

5、Guangbin Dou*, David Whalley and Changqing liu. Mechanical Characterization of Individual Ni/Au Coated Microsize Polymer Particles[J]. Applied Physics Letters, 2008, 92(10), p.104108.

面向国家重大需求，聚焦惯性制导、压力感知与器件制造等科学技术问题，在MEMS传感、系统集成及关键共性器件工艺等核心技术领域取得重大突破。研究成果成功应用于行星探测等重大工程，有力推动了相关产业的技术升级与跨越式发展。

1、国家级特聘教授（国家级）

2、江苏省“双创人才”，江苏省（省级）

3、“紫金山计划英才高峰项目”人才，南京市（市级）

4、bevictor伟德官网首席教授（正高二级）

博士生每年2-3名；

硕士生每年4-5名；

招生信息，请发邮件：gdou@seu.edu.cn